A motherboard interconnection method includes positioning a first and a third electronic elements on a top layer of a motherboard interconnection device, and positioning a second and a fourth electronic elements on a bottom layer of the motherboard interconnection device. The method connects a first end of the first electronic element on the top layer to the first end of the second electronic element on the bottom layer with a first via hole, and connects the first end of the third electronic element on the top layer to the first end of the fourth electronic element on the bottom layer with a second via hole. The method further connects a second ends of the two electronic elements on the top layer to a first part, and connects the second ends of the two electronic elements on the bottom layer to a second part.