A retainer for accommodating an electronic component, in particular a sensor, including a main body or a main body element, which comes in contact with the electronic component, and is composed of a main body material. The retainer further includes a transition layer, which is connected to the main body and a thermoplastic connecting layer or a first connecting element, which is connected to the transition layer. The thermoplastic connecting layer is designed such that the thermoplastic connecting layer can be brought into a reversible mechanical/physical connection to a contact element or a second connecting element by a preceding partial melting process.