Invention Application
US20120248632A1 PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE
有权
光敏胶粘剂组合物，薄膜粘合剂，粘合片，粘合剂图案，带粘合层的半导体滤波器，半导体器件
- Patent Title: PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE
- Patent Title (中): 光敏胶粘剂组合物，薄膜粘合剂，粘合片，粘合剂图案，带粘合层的半导体滤波器，半导体器件
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Application No.: US13410702Application Date: 2012-03-02
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Publication No.: US20120248632A1Publication Date: 2012-10-04
- Inventor: Kazuyuki MITSUKURA , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
- Applicant: Kazuyuki MITSUKURA , Takashi Kawamori , Takashi Masuko , Shigeki Katogi
- Priority: JPP2009-250667 20091030; JPP2010-244033 20101029
- Main IPC: G03F7/004
- IPC: G03F7/004 ; B32B7/12 ; C09J7/00 ; H01L23/28
Abstract:
The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa.
Public/Granted literature
Information query
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