A light emitting module includes a light source, a printed circuit board, and a connector part. The printed circuit board includes a wiring layer having a wiring electrically connected to the light source, a heat dissipation layer formed under the wiring layer, and a through hole passing through the wiring layer and the heat dissipation layer. The connector part is disposed in the through hole and is electrically connected to the wiring for transmitting a power through the wiring to the light source. The heat dissipation layer may effectively dissipate the heat generated from the light source. A height of a protrusion of the connector part protruding from an upper surface of the printed circuit board may be minimized, such that a dark area caused by the connector part may be minimized, and display quality of a display apparatus including the light emitting module may be optimized.