An embodiment of the present invention relates to a method for manufacturing a fabric type circuit board and can form a fine pattern by performing the etching process on the metal layer when a circuit pattern is formed, transfer the circuit pattern to the fabric by a thermosetting adhesive film to secure strong durability against flexibility of the fabric and sufficient electric conductivity and maintain ventilation, and apply various mounting methods such as soldering, wire bonding, or the like, when electronic parts are mounted.