Disclosed is a memory device provided with a plurality of memory cells and a lead-out line (12) shared among the memory cells. Each memory cell is provided with a transistor (6) formed above a substrate (1) and a variable resistance element (10) having a lower electrode (7), an upper electrode (9) that comprises a noble metal, and a variable resistance layer (8) disposed between the lower electrode (7) and the upper electrode (9). The resistance value of the variable resistance layer (8) changes reversibly in response to electric pulses that go through the transistor (6) and are applied between the lower electrode (7) and the upper electrode (9). The lead-out line (12) is in direct contact with the upper electrodes (9) of the memory cells.