发明申请
US20120256574A1 POWER SEMICONDUCTOR MODULE, POWER CONVERTING APPARATUS AND RAILWAY CAR
有权
功率半导体模块，电力转换设备和铁路车辆
- 专利标题： POWER SEMICONDUCTOR MODULE, POWER CONVERTING APPARATUS AND RAILWAY CAR
- 专利标题（中）： 功率半导体模块，电力转换设备和铁路车辆
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申请号： US13517904申请日： 2010-01-18
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公开(公告)号： US20120256574A1公开(公告)日： 2012-10-11
- 发明人: Takeshi Tanaka , Yasushi Nakayama
- 申请人： Takeshi Tanaka , Yasushi Nakayama
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Electric Corporation
- 当前专利权人： Mitsubishi Electric Corporation
- 当前专利权人地址： JP Tokyo
- 国际申请： PCT/JP2010/050512 WO 20100118
- 主分类号： H02P6/14
- IPC分类号： H02P6/14 ; H01L29/20 ; H01L29/16
摘要：
A power semiconductor module applied to a power converting apparatus for a railway car includes an element pair formed by connecting an IGBT and an SiC-FWD in anti-parallel to each other and an element pair formed by connecting an Si-IGBT and an SiC-FWD in anti-parallel to each other. The element pair and the element pair are housed in one module and configured as a 2-in-1 module in a manner that the first element pair operates as a positive side arm of the power converting apparatus and the second element pair operates as a negative side arm of the power converting apparatus. The element pairs are formed such that a ratio of an occupied area of SiC-FWD chips to an occupied area of IGBT chips in the element pairs is equal to or higher than 15% and lower than 45%.
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