Invention Application
- Patent Title: EARPHONE STRUCTURE WITH NO-SECTION-DIFFERENCE DESIGN AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 具有无差异设计的耳机结构及其制造方法
-
Application No.: US13082752Application Date: 2011-04-08
-
Publication No.: US20120257780A1Publication Date: 2012-10-11
- Inventor: Chung-Yi Huang , I-Ming Lin , Yu-Lan Liang , Chiu-Yun Tung
- Applicant: Chung-Yi Huang , I-Ming Lin , Yu-Lan Liang , Chiu-Yun Tung
- Applicant Address: CN Shen Zhen
- Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Current Assignee: MERRY ELECTRONICS (SHENZHEN) CO., LTD.
- Current Assignee Address: CN Shen Zhen
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H05K13/00

Abstract:
An earphone structure with no-section-difference design is provided, including an earphone casing, a transmission wire and a strain relief thereof. The earphone casing has a joining end to join with a joining section of the transmission wire The strain relief is formed at where the earphone casing and the transmission wire are joined. Along from the earphone casing to the transmission wire, diameter of the strain relief decreases progressively to a same diameter with that of the transmission wire, thereby providing a no-section-difference exterior look thereof between the strain relief and the transmission wire.
Information query