发明申请
US20120267030A1 Adhesive Dispensing Profile Enhancement 有权
粘合剂分配型材增强

Adhesive Dispensing Profile Enhancement
摘要:
A first method is provided that comprises the steps of: measuring a first surface disposed on a first substrate, measuring a second surface disposed on a second substrate, calculating a variable gap between the first surface and the second surface, depositing a variable amount of adhesive on the first surface of the first substrate based at least in part on the calculation of the variable gap, and placing the second substrate over the first substrate, wherein the adhesive is disposed between the first surface of the first substrate and the second surface of the second substrate.
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