发明申请
- 专利标题: Adhesive Dispensing Profile Enhancement
- 专利标题(中): 粘合剂分配型材增强
-
申请号: US13445509申请日: 2012-04-12
-
公开(公告)号: US20120267030A1公开(公告)日: 2012-10-25
- 发明人: Robert S. Hall , David Boyd , Anthony Van Heugten
- 申请人: Robert S. Hall , David Boyd , Anthony Van Heugten
- 申请人地址: US VA Roanoke
- 专利权人: PixelOptics, Inc.
- 当前专利权人: PixelOptics, Inc.
- 当前专利权人地址: US VA Roanoke
- 主分类号: B29C65/48
- IPC分类号: B29C65/48
摘要:
A first method is provided that comprises the steps of: measuring a first surface disposed on a first substrate, measuring a second surface disposed on a second substrate, calculating a variable gap between the first surface and the second surface, depositing a variable amount of adhesive on the first surface of the first substrate based at least in part on the calculation of the variable gap, and placing the second substrate over the first substrate, wherein the adhesive is disposed between the first surface of the first substrate and the second surface of the second substrate.
公开/授权文献
- US09096026B2 Adhesive dispensing profile enhancement 公开/授权日:2015-08-04
信息查询