发明申请
- 专利标题： HEAT DISSPIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- 专利标题（中）： 散热基板及其制造方法
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申请号： US13536815申请日： 2012-06-28
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公开(公告)号： US20120273116A1公开(公告)日： 2012-11-01
- 发明人: Young Ho SOHN , Seog Moon CHOI , Sung Keun PARK , Young Ki LEE , Bum Sik JANG , Ji Hyun PARK
- 申请人： Young Ho SOHN , Seog Moon CHOI , Sung Keun PARK , Young Ki LEE , Bum Sik JANG , Ji Hyun PARK
- 申请人地址： KR Gyunggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-do
- 优先权： KR10-2009-0044687 20090521
- 主分类号： B32B38/04
- IPC分类号： B32B38/04 ; B32B38/08
摘要：
Disclosed herein is a heat dissipating substrate having a structure in which two two-layered core substrates, each including a metal core functioning to radiate heat, are laminated and connected in parallel to each other, thus accomplishing more improved radiation performance, and a method of manufacturing the same.
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