Invention Application
US20120273931A1 Integrated circuit chip package and manufacturing method thereof
审中-公开
集成电路芯片封装及其制造方法
- Patent Title: Integrated circuit chip package and manufacturing method thereof
- Patent Title (中): 集成电路芯片封装及其制造方法
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Application No.: US13200161Application Date: 2011-09-20
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Publication No.: US20120273931A1Publication Date: 2012-11-01
- Inventor: Hsi-Chen Yang , Ya-Tzu Wu
- Applicant: Hsi-Chen Yang , Ya-Tzu Wu
- Assignee: Richtek Technology Corporation, R.O.C.
- Current Assignee: Richtek Technology Corporation, R.O.C.
- Priority: TW100114457 20110426
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/50
Abstract:
The present invention discloses an integrated circuit (IC) chip package and a manufacturing method thereof. The IC chip package includes: a lead frame, including a lead frame array having plural conductive cells, wherein some of the conductive cells are respectively electrically connected with corresponding first extended wires; at least one redistribution layer, wherein each redistribution layer includes plural second extended wires, which are respectively electrically connected to the first extended wires or the second extended wires of another redistribution layer; and a solder array, including plural solder balls, which are electrically connected to the lead frame array.
Information query
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