发明申请
- 专利标题: MANUFACTURING METHOD OF ARRAY SUBSTRATE
- 专利标题(中): 阵列基板的制造方法
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申请号: US13458478申请日: 2012-04-27
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公开(公告)号: US20120276697A1公开(公告)日: 2012-11-01
- 发明人: Zhanfeng CAO , Seongyeol YOO , Qi YAO
- 申请人: Zhanfeng CAO , Seongyeol YOO , Qi YAO
- 申请人地址: CN Beijing
- 专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人: BOE TECHNOLOGY GROUP CO., LTD.
- 当前专利权人地址: CN Beijing
- 优先权: CN201110112057.7 20110429; CN201210124197.0 20120425
- 主分类号: H01L21/336
- IPC分类号: H01L21/336
摘要:
A manufacturing method of an array substrate, comprising the following steps: S1 forming a gate signal line and a gate electrode on a base substrate, successively depositing a gate insulating layer, an active layer, and a metal layer, faulting a mask formed of photoresist on the metal layer, and removing the metal layer outside a region for forming a data line and source/drain electrodes through the mask; S2. simultaneously etching the active layer and ashing the photoresist so as to expose the metal layer within a channel region; S3. etching the active layer exposed by the photoresist after being ashed after the step S2; S4. removing the metal layer within the channel region.
公开/授权文献
- US09190429B2 Manufacturing method of array substrate 公开/授权日:2015-11-17
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