发明申请
- 专利标题： HEAT DISSIPATION ASSEMBLY FOR ELECTRONIC DEVICE
- 专利标题（中）： 电子设备散热装置
-
申请号： US13166823申请日： 2011-06-23
-
公开(公告)号： US20120289142A1公开(公告)日： 2012-11-15
- 发明人: LEI LIU
- 申请人： LEI LIU
- 申请人地址： TW Tu-Cheng CN Shenzhen City
- 专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- 当前专利权人： HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- 当前专利权人地址： TW Tu-Cheng CN Shenzhen City
- 优先权： CN201110119779.5 20110510
- 主分类号： F24F13/02
- IPC分类号： F24F13/02
摘要：
A heat dissipation assembly includes a heat sink and an airflow guide. The airflow guide includes a top wall, two sidewalls connected to the top wall, and an airflow guide component mounted on an inner surface of the top wall. The top wall and the two sidewalls cooperatively define an air passage for allowing air to flow through. The heat sink is disposed in the air passage and the airflow guide component is configured to guide air through the air passage to the heat sink.
信息查询
