发明申请
US20120289173A1 INTERFACE OF MULTI CHIP MODULE 审中-公开
多芯片模块接口

INTERFACE OF MULTI CHIP MODULE
摘要:
Disclosed herein is an interface of a multi chip module transmitting and receiving data among a plurality of chips. An interface of a multi chip module includes a communication unit that is provided in the chips and transmits and receives the data; and a radio communication unit that is provided outside the chips, converts the data transmitted from the communication unit into radio signals and wirelessly transmits the radio signals, and demodulates radio signals received from other chips into data and transmits the data to the communication unit, whereby wired communication chips can implement radio communication.
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