发明申请
- 专利标题: INTERFACE OF MULTI CHIP MODULE
- 专利标题(中): 多芯片模块接口
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申请号: US13444538申请日: 2012-04-11
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公开(公告)号: US20120289173A1公开(公告)日: 2012-11-15
- 发明人: Kyoung Ho Lee , Su Bong Jang , Dong Hwan Lee , Hee Soo Yoon
- 申请人: Kyoung Ho Lee , Su Bong Jang , Dong Hwan Lee , Hee Soo Yoon
- 专利权人: SAMSUNG Electro-Machanics Co., Ltd.
- 当前专利权人: SAMSUNG Electro-Machanics Co., Ltd.
- 优先权: KR10-2011-0043529 20110509
- 主分类号: H04B1/44
- IPC分类号: H04B1/44 ; H04B1/40 ; H04B1/04
摘要:
Disclosed herein is an interface of a multi chip module transmitting and receiving data among a plurality of chips. An interface of a multi chip module includes a communication unit that is provided in the chips and transmits and receives the data; and a radio communication unit that is provided outside the chips, converts the data transmitted from the communication unit into radio signals and wirelessly transmits the radio signals, and demodulates radio signals received from other chips into data and transmits the data to the communication unit, whereby wired communication chips can implement radio communication.
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