Invention Application
- Patent Title: WETTING WAVE FRONT CONTROL FOR REDUCED AIR ENTRAPMENT DURING WAFER ENTRY INTO ELECTROPLATING BATH
- Patent Title (中): 在波浪进入电镀浴期间减少空气进入的湿度正面控制
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Application No.: US13460423Application Date: 2012-04-30
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Publication No.: US20120292192A1Publication Date: 2012-11-22
- Inventor: Manish RANJAN , Shantinath GHONGADI , Frederick Dean WILMOT , Douglas HILL , Bryan L. BUCKALEW
- Applicant: Manish RANJAN , Shantinath GHONGADI , Frederick Dean WILMOT , Douglas HILL , Bryan L. BUCKALEW
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D17/00
Abstract:
Methods described herein manage wafer entry into an electrolyte so that air entrapment due to initial impact of the wafer and/or wafer holder with the electrolyte is reduced and the wafer is moved in such a way that an electrolyte wetting wave front is maintained throughout immersion of the wafer also minimizing air entrapment.
Public/Granted literature
- US09028666B2 Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath Public/Granted day:2015-05-12
Information query
