发明申请
- 专利标题： BARRIER STRUCTURE
- 专利标题（中）： 障碍物结构
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申请号： US13566081申请日： 2012-08-03
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公开(公告)号： US20120292736A1公开(公告)日： 2012-11-22
- 发明人: Thorbjörn Ebefors , Tomas Bauer
- 申请人： Thorbjörn Ebefors , Tomas Bauer
- 申请人地址： SE Jarfalla
- 专利权人： SILEX MICROSYSTEMS AB
- 当前专利权人： SILEX MICROSYSTEMS AB
- 当前专利权人地址： SE Jarfalla
- 优先权： SE0700172-0 20070125
- 主分类号： H01L29/06
- IPC分类号： H01L29/06
摘要：
A starting substrate in the form of a semiconductor wafer (1) has a first side and a second side, the sides being plane-parallel with respect to each other, and has a thickness rendering it suitable for processing without significant risk of being damaged, for the fabrication of combined analogue and digital designs, the wafer including at least two partitions (A1, A2; DIGITAL, ANALOGUE) electrically insulated from each other by insulating material (2; 38; 81; L) extending entirely through the wafer. A method for making such substrates including etching trenches in a wafer, and filling trenches with insulating material is also described.
公开/授权文献
- US08598676B2 Barrier structure 公开/授权日：2013-12-03
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