发明申请
- 专利标题: SLIDING MODULE FOR ELECTRONIC DEVICE
- 专利标题(中): 电子设备滑动模块
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申请号: US13220186申请日: 2011-08-29
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公开(公告)号: US20120293927A1公开(公告)日: 2012-11-22
- 发明人: CHAO DUAN , CHIA-HUA CHEN
- 申请人: CHAO DUAN , CHIA-HUA CHEN
- 申请人地址: HK Kowloon CN ShenZhen City
- 专利权人: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- 当前专利权人: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: HK Kowloon CN ShenZhen City
- 优先权: CN201110125274.X 20110516
- 主分类号: H05K7/00
- IPC分类号: H05K7/00 ; E05D7/00
摘要:
A sliding module includes a first section, a second section, a pivot plate, a hinge module and an assist lever. Two sides of the pivot plate are respectively rotatably connected to the first section and the hinge module. The hinge module is positioned on the second section. Two ends of the assist lever are respectively rotatably connected to the first section and the second section. The first section brings the pivot plate to rotate relative to the hinge module, and elevates the assist lever, the pivot plate and the assist lever bring the first section to move and rotate relative to the second section in a tilted orientation.
公开/授权文献
- US08797730B2 Sliding module for electronic device 公开/授权日:2014-08-05
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