发明申请
US20120294042A1 LED MODULE, BACKLIGHT UNIT INCLUDING THE LED MODULE, AND METHOD FOR MANUFACTURING THE LED MODULE
有权
LED模块，背光单元，包括LED模块，以及制造LED模块的方法
- 专利标题： LED MODULE, BACKLIGHT UNIT INCLUDING THE LED MODULE, AND METHOD FOR MANUFACTURING THE LED MODULE
- 专利标题（中）： LED模块，背光单元，包括LED模块，以及制造LED模块的方法
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申请号： US13475323申请日： 2012-05-18
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公开(公告)号： US20120294042A1公开(公告)日： 2012-11-22
- 发明人: Jee Hoon SUNG , Jin Hyun CHO , Jung Kyun KIM
- 申请人： Jee Hoon SUNG , Jin Hyun CHO , Jung Kyun KIM
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2011-0046759 20110518
- 主分类号： G09F13/18
- IPC分类号： G09F13/18 ; H01L33/48
摘要：
A light emitting diode (LED) module having a structure capable of effectively dissipating heat generated from an LED chip thereof, and a backlight unit including the same are disclosed. The LED module includes a base made of a metal material, an insulating layer provided on the base, a circuit layer provided on the insulating layer, an LED package provided on the circuit layer, and a bonding layer extending through the insulating layer and the circuit layer, to connect the LED package to the base.