Invention Application
- Patent Title: INJECTION MOLDING APPARATUS
- Patent Title (中): 注射成型设备
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Application No.: US13475398Application Date: 2012-05-18
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Publication No.: US20120294976A1Publication Date: 2012-11-22
- Inventor: Jin Soo PYO , Jong Won LEE , Jin Hyun CHO , Jin Sub KIM
- Applicant: Jin Soo PYO , Jong Won LEE , Jin Hyun CHO , Jin Sub KIM
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2011-0047975 20110520
- Main IPC: B29C45/73
- IPC: B29C45/73 ; B29C45/03
Abstract:
An injection molding apparatus is provided. The injection molding apparatus includes a mold, a plate heater mounted to the mold to heat the mold, and a cooling passage provided above or below the plate heater.
Public/Granted literature
- US08840394B2 Injection molding apparatus having a plate heater and having a cooling passage or an insulation space Public/Granted day:2014-09-23
Information query
