发明申请
- 专利标题： SEMICONDUCTOR WAFER MOUNTING METHOD AND SEMICONDUCTOR WAFER MOUNTING APPARATUS
- 专利标题（中）： 半导体波形安装方法和半导体波形安装设备
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申请号： US13454477申请日： 2012-04-24
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公开(公告)号： US20120298283A1公开(公告)日： 2012-11-29
- 发明人: Masayuki Yamamoto , Chouhei Okuno
- 申请人： Masayuki Yamamoto , Chouhei Okuno
- 优先权： JP2011-119262 20110527
- 主分类号： B29C65/50
- IPC分类号： B29C65/50
摘要：
A workpiece is unloaded from a wafer-receiving container. A first discriminating sensor detects a front surface of the workpiece, and determines either a semiconductor wafer or a spacer is the workpiece. Where the workpiece is a wafer, the first discriminating sensor also determines whether or not a protective tape is on the front surface of the workpiece. Where it is determined that a protective tape is not on the front surface, a second discriminating sensor detects a back surface of the wafer for discriminating the presence or absence of the protective tape.
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