A cut which penetrates a resin layer is formed in the resin layer such that the cut surrounds a third upper surface. A film is formed such that the film covers the whole resin layer except for a bottom surface of the resin layer inside the cut and at least a portion of the resin layer is exposed outside the cut. The resin layer which is wholly covered with the film is left inside the cut, and the whole resin layer continuously formed with a surface exposed from the film is removed outside the cut. A bump is formed by the resin layer and the film inside the cut, and a shutter and at least a portion of a drive part are formed by the film outside the cut in a state where these parts are floated from a first substrate.