Invention Application
- Patent Title: HEAT-DISSIPATION DEVICE AND ELECRTONIC DEVICE THEREON
- Patent Title (中): 热释放装置及其装置
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Application No.: US13364306Application Date: 2012-02-01
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Publication No.: US20120300408A1Publication Date: 2012-11-29
- Inventor: Han Yu Kao , Tse Hsine Liao , Kuei Min Chen
- Applicant: Han Yu Kao , Tse Hsine Liao , Kuei Min Chen
- Assignee: GIGA- BYTE TECHNOLOGY CO., LTD.
- Current Assignee: GIGA- BYTE TECHNOLOGY CO., LTD.
- Priority: TW100118233 20110525
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A heat dissipation device is used for a circuit board, and plural electronic components are mounted on a surface of the circuit board. The heat dissipation device includes a heat dissipation plate that is made of metal. Once the heat dissipation plate shields above a surface of the circuit board, a distance exists between the heat dissipation plate and the surface so as to form an air flow passage to increase the heat dissipation performance.
Information query
