Invention Application
- Patent Title: ENCLOSURE AND CABLE CLIP
- Patent Title (中): 外壳和电缆夹
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Application No.: US13166784Application Date: 2011-06-22
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Publication No.: US20120300422A1Publication Date: 2012-11-29
- Inventor: ZHENG-HENG SUN
- Applicant: ZHENG-HENG SUN
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: CN201110133537.1 20110523
- Main IPC: H05K5/00
- IPC: H05K5/00 ; F16L3/22

Abstract:
An enclosure includes a bottom plate, a circuit board, and a cable clip. A number of mounting posts extend from the bottom plate. Each mounting post axially defines a mounting hole. The cable clip includes a main body, a mounting portion extending from a first end of the main body, and a clipping portion extending from a second end of the main body to bind cables. The cable clip defines a first through hole, for a corresponding one mounting post extending through. The circuit board defines a number of second through holes. The circuit board is supported on the mounting posts, with the second through holes aligning with the mounting holes. Fasteners extend through the second through holes to engage in the mounting holes to mount the circuit board to the bottom plate. The mounting portion is clamped between the circuit board and the bottom plate.
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