Invention Application
US20120300424A1 Crystal Device Without External Package and Manufacturing Method Thereof
审中-公开
没有外部封装的晶体器件及其制造方法
- Patent Title: Crystal Device Without External Package and Manufacturing Method Thereof
- Patent Title (中): 没有外部封装的晶体器件及其制造方法
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Application No.: US13577447Application Date: 2010-11-16
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Publication No.: US20120300424A1Publication Date: 2012-11-29
- Inventor: Fei Lv , Hu Ge , Jie Song
- Applicant: Fei Lv , Hu Ge , Jie Song
- Applicant Address: CN Shenzhen, Guangdong
- Assignee: ZTE CORPORATION
- Current Assignee: ZTE CORPORATION
- Current Assignee Address: CN Shenzhen, Guangdong
- Priority: CN201010275494.6 20100903
- International Application: PCT/CN10/78788 WO 20101116
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K3/00

Abstract:
The disclosure discloses a crystal device without an external package, which comprises: a crystal body (21) and two pins (22), wherein the crystal body (21) is a cylindrical body port of a crystal with the external package (15) and redundant pins (12, 13) being removed, and is arranged on a Printed Circuit Board (PCB) horizontally. The two pins (22) are connected to a bottom end of the crystal body (21). Extension parts of the two pins (22) are inclined towards the PCB, and become horizontal when they reach the PCB and are welded to the PCB, and a spacing between the two pins (22) increases gradually. The disclosure also discloses a method for manufacturing a crystal device without a package. The device and method can reduce the cost and make the welding more convenient.
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