Invention Application
- Patent Title: INTEGRATED CIRCUIT MEMORY DEVICE
- Patent Title (中): 集成电路存储器件
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Application No.: US13478774Application Date: 2012-05-23
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Publication No.: US20120300555A1Publication Date: 2012-11-29
- Inventor: Choong-Sun SHIN , Joo-Sun CHOI
- Applicant: Choong-Sun SHIN , Joo-Sun CHOI
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Priority: KR10-2011-0117380 20111111
- Main IPC: G11C7/10
- IPC: G11C7/10 ; G11C7/22

Abstract:
A semiconductor memory device includes a plurality of memory regions formed on one chip, each of the memory regions having a plurality of volatile memory cells that are formed with a density or capacity of 2̂K bits, where K is an integer greater than or equal to 0, and a plurality of input/output (I/O) terminals for inputting and outputting data of the volatile memory cells, and at least one peripheral region that controls a write operation for writing data into the memory regions and a read operation for reading data from the memory regions based on a command and an address input from outside. Thus, a total or entire density of the memory regions corresponds to a non-standard (or ‘interim’) density so that the semiconductor memory device may have an interim density.
Public/Granted literature
- US08817549B2 Integrated circuit memory device Public/Granted day:2014-08-26
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