发明申请
- 专利标题： Packaging Jig and Process for Semiconductor Packaging
- 专利标题（中）： 包装夹具和半导体封装工艺
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申请号： US13117901申请日： 2011-05-27
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公开(公告)号： US20120302008A1公开(公告)日： 2012-11-29
- 发明人: Chi-Ming Huang , Tsung-Ding Wang
- 申请人： Chi-Ming Huang , Tsung-Ding Wang
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/78
- IPC分类号： H01L21/78 ; B29C65/78
摘要：
An embodiment is a method for semiconductor packaging. The method comprises attaching a chip to a carrier substrate through a first side of a jig, the chip being attached by bumps; applying balls to bond pads on the carrier substrate through a second side of the jig; and simultaneously reflowing the bumps and the balls. According to a further embodiment, a packaging jig comprises a cover, a base, and a connector. The cover has a first window through the cover. The base has a second window through the base. The first window exposes a first surface of a volume intermediate the cover and the base, and the second window exposes a second surface of the volume. The first surface is opposite the volume from the second surface. The connector aligns and couples the cover to the base.
公开/授权文献
- US08691629B2 Packaging jig and process for semiconductor packaging 公开/授权日：2014-04-08
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