Invention Application
- Patent Title: METHOD OF FORMING HIGH GROWTH RATE, LOW RESISTIVITY GERMANIUM FILM ON SILICON SUBSTRATE
-
Application No.: US13482585Application Date: 2012-05-29
-
Publication No.: US20120306054A1Publication Date: 2012-12-06
- Inventor: Yi-Chiau Huang , Errol Antonio C. Sanchez , Xianzhi Tao
- Applicant: Yi-Chiau Huang , Errol Antonio C. Sanchez , Xianzhi Tao
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L29/16 ; H01L21/322

Abstract:
A method of forming a doped semiconductor layer on a substrate is provided. A foundation layer having a crystal structure compatible with a thermodynamically favored crystal structure of the doped semiconductor layer is formed on the substrate and annealed, or surface annealed, to substantially crystallize the surface of the foundation layer. The doped semiconductor layer is formed on the foundation layer. Each layer may be formed by vapor deposition processes such as CVD. The foundation layer may be germanium and the doped semiconductor layer may be phosphorus doped germanium.
Public/Granted literature
- US08759201B2 Method of forming high growth rate, low resistivity germanium film on silicon substrate Public/Granted day:2014-06-24
Information query
IPC分类: