Invention Application
- Patent Title: HIGH-FREQUENCY MODULE MANUFACTURING METHOD
- Patent Title (中): 高频模块制造方法
-
Application No.: US13587297Application Date: 2012-08-16
-
Publication No.: US20120306063A1Publication Date: 2012-12-06
- Inventor: Jun'ichi KIMURA , Tomohide Ogura , Takayuki Hiruma , Misao Kanba , Masahisa Nakaguchi , Motoyoshi Kitagawa
- Applicant: Jun'ichi KIMURA , Tomohide Ogura , Takayuki Hiruma , Misao Kanba , Masahisa Nakaguchi , Motoyoshi Kitagawa
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Priority: JP2010-034461 20100219
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/28 ; H01L21/78
Abstract:
In a method of manufacturing a high-frequency module, a resin substrate with a high frequency circuit including an electronic component mounted thereon is placed so that the electronic component faces a resin bath. A resin which is in a non-flowable state in the resin bath is softened until the resin becomes flowable, and air in space formed between the resin substrate and the resin is sucked. The resin substrate is brought into contact with a liquid surface of the resin. The resin is pressurized and allowed to flow into a gap between the resin substrate and the electronic component. The resin is cured so that a resin portion is formed on the resin substrate. A shield metal film is formed on a surface of the resin portion.
Information query
IPC分类:
