发明申请
- 专利标题： INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
- 专利标题（中）： 具有包装堆叠的集成电路包装系统及其制造方法
-
申请号： US13118955申请日： 2011-05-31
-
公开(公告)号： US20120306102A1公开(公告)日： 2012-12-06
- 发明人: NamJu Cho , HeeJo Chi , HanGil Shin
- 申请人： NamJu Cho , HeeJo Chi , HanGil Shin
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L21/50
摘要：
A method of manufacture of an integrated circuit packaging system includes: providing a base package carrier; mounting an interposer over the base package carrier; forming a base package encapsulation over the base package carrier and the interposer with the base package encapsulation having a cavity for exposing the interposer; and forming a support recess in the base package encapsulation between a non-horizontal edge of the base package encapsulation and the cavity.