Invention Application
- Patent Title: CELL CHIP AND METHOD FOR MANUFACTURING THE SAME
- Patent Title (中): 细胞芯片及其制造方法
-
Application No.: US13482316Application Date: 2012-05-29
-
Publication No.: US20120309649A1Publication Date: 2012-12-06
- Inventor: Dong Woo LEE , Sang Hyun Yi , Bo Sung Ku
- Applicant: Dong Woo LEE , Sang Hyun Yi , Bo Sung Ku
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2011-0051445 20110530
- Main IPC: C40B40/02
- IPC: C40B40/02 ; C40B50/06
Abstract:
Disclosed herein are a cell chip and a method for manufacturing the same. The cell chip may include: a substrate; and a first contact member disposed on the substrate, wherein a top end of the first contact member is provided with a first inclined contact surface inclined with respect to the substrate.
Public/Granted literature
- US08673622B2 Cell chip and method for manufacturing the same Public/Granted day:2014-03-18
Information query
