发明申请
- 专利标题： COMPACT THERMALLY CONTROLLED THIN FILM RESISTORS UTILIZING SUBSTRATE CONTACTS AND METHODS OF MANUFACTURE
- 专利标题（中）： 使用基板触点的紧密热控薄膜电阻及其制造方法
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申请号： US13588218申请日： 2012-08-17
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公开(公告)号： US20120313215A1公开(公告)日： 2012-12-13
- 发明人: Joseph M. LUKAITIS , Jed H. RANKIN , Robert R. ROBISON , Dustin K. SLISHER , Timothy D. SULLIVAN
- 申请人： Joseph M. LUKAITIS , Jed H. RANKIN , Robert R. ROBISON , Dustin K. SLISHER , Timothy D. SULLIVAN
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L29/02
- IPC分类号： H01L29/02 ; H01L29/06
摘要：
A method of forming a semiconductor structure includes forming a resistor on an insulator layer over a substrate, and forming at least one dielectric layer over the resistor. The method also includes forming a substrate contact through the at least one dielectric layer, through the resistor, through the insulator layer, and into the substrate. The substrate contact comprises a high thermal conductivity material.
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