Invention Application
- Patent Title: COMPACT THERMALLY CONTROLLED THIN FILM RESISTORS UTILIZING SUBSTRATE CONTACTS AND METHODS OF MANUFACTURE
- Patent Title (中): 使用基板触点的紧密热控薄膜电阻及其制造方法
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Application No.: US13588218Application Date: 2012-08-17
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Publication No.: US20120313215A1Publication Date: 2012-12-13
- Inventor: Joseph M. LUKAITIS , Jed H. RANKIN , Robert R. ROBISON , Dustin K. SLISHER , Timothy D. SULLIVAN
- Applicant: Joseph M. LUKAITIS , Jed H. RANKIN , Robert R. ROBISON , Dustin K. SLISHER , Timothy D. SULLIVAN
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Main IPC: H01L29/02
- IPC: H01L29/02 ; H01L29/06
Abstract:
A method of forming a semiconductor structure includes forming a resistor on an insulator layer over a substrate, and forming at least one dielectric layer over the resistor. The method also includes forming a substrate contact through the at least one dielectric layer, through the resistor, through the insulator layer, and into the substrate. The substrate contact comprises a high thermal conductivity material.
Public/Granted literature
- US08541864B2 Compact thermally controlled thin film resistors utilizing substrate contacts and methods of manufacture Public/Granted day:2013-09-24
Information query
IPC分类:
