Low weight, low cost, low complexity systems and methods for performing large thermal transfer during worst-case conditions to ensure a light-emitting diode (LED) light. An exemplary device includes a housing with a sealed cavity, a circuit board having a first side attached to one side of the housing, a plurality of light sources attached to a second side of the circuit board and a material located within the sealed cavity. The material changes phase at a predefined temperature. The housing includes a plurality of protrusions that extend into the cavity. The housing and the protrusions transfer heat generated by the light sources into the material. The plurality of light sources include light-emitting diodes (LEDs). A plurality of optical elements direct light generated by the LEDs. The optical elements are attached to the circuit board.