发明申请
- 专利标题: Bonding Method and Bonded Body
- 专利标题(中): 粘结方法和粘结体
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申请号: US13533521申请日: 2012-06-26
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公开(公告)号: US20120315450A1公开(公告)日: 2012-12-13
- 发明人: Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
- 申请人: Takatoshi Yamamoto , Mitsuru Sato , Shintaro Asuke , Yoshiaki Mori , Kazuhiro Gomi
- 申请人地址: JP Tokyo
- 专利权人: SEIKO EPSON CORPORATION
- 当前专利权人: SEIKO EPSON CORPORATION
- 当前专利权人地址: JP Tokyo
- 优先权: JP2007-307620 20071128
- 主分类号: B32B37/12
- IPC分类号: B32B37/12 ; B32B3/10 ; B32B37/06
摘要:
A bonding method of bonding two base members together through a bonding film is provided. The bonding method is a method for forming a bonded body in which a first base member and a second base member are bonded together through the bonding film. The bonding method includes: applying a liquid material containing a silicone material composed of silicone compounds onto a surface of at least one of the first and second base members to form a liquid coating on the surface; drying the liquid coating so that it is transformed into the bonding film on the surface of the at least one of the first and second base members; and applying energy to the bonding film so that a bonding property is developed in the vicinity of a surface thereof, to thereby bond the first and second base members together through the bonding film.
公开/授权文献
- US08679283B2 Bonding method and bonded body 公开/授权日:2014-03-25
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