The present invention provides a carrier material for a thin layer base material, which does not cause defects such as generation of wrinkles and scratches, and impossibility of shape retention even in the case of using a thin layer base material in processing step, transporting step or the like in the state of being bonded to a carrier material, and is also excellent in workability. Disclosed is a carrier material for a thin layer base material, including a support having a thickness of 50 to 150 μm and formed from a polyester-based resin, and a pressure-sensitive adhesive layer formed on at least one surface of the support.