发明申请
- 专利标题： SPALLING METHODS TO FORM MULTI-JUNCTION PHOTOVOLTAIC STRUCTURE
- 专利标题（中）： 用于形成多结构光伏结构的方法
-
申请号： US13160067申请日： 2011-06-14
-
公开(公告)号： US20120318334A1公开(公告)日： 2012-12-20
- 发明人: Stephen W. Bedell , Devendra K. Sadana , Davood Shahrjerdi
- 申请人： Stephen W. Bedell , Devendra K. Sadana , Davood Shahrjerdi
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L31/075
- IPC分类号： H01L31/075 ; H01L21/78
摘要：
A method cleaving a semiconductor material that includes providing a germanium substrate having a germanium and tin alloy layer is present therein. A stressor layer is deposited on a surface of the germanium substrate. A stress from the stressor layer is applied to the germanium substrate, in which the stress cleaves the germanium substrate to provide a cleaved surface. The cleaved surface of the germanium substrate is then selective to the germanium and tin alloy layer of the germanium substrate. In another embodiment, the germanium and tin alloy layer may function as a fracture plane during a spalling method.