发明申请
- 专利标题： POWER MODULE PACKAGE AND METHOD FOR FABRICATING THE SAME
- 专利标题（中）： 电源模块包装及其制造方法
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申请号： US13235176申请日： 2011-09-16
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公开(公告)号： US20120319259A1公开(公告)日： 2012-12-20
- 发明人: Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
- 申请人： Kwang Soo Kim , Ji Hyun Park , Young Ki Lee , Seog Moon Choi
- 申请人地址： KR Gyunggi-do
- 专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址： KR Gyunggi-do
- 优先权： KR1020110058468 20110616
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/50
摘要：
Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: first and second lead frames arranged to face each other, both or either of the first and second frames being made of aluminum; anodized layers formed on portions of the lead frame(s) made of aluminum in the first and second lead frames; and semiconductor devices mounted on first surfaces of the first and second lead frames.
公开/授权文献
- US08729683B2 Power module package and method for fabricating the same 公开/授权日：2014-05-20
信息查询
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