发明申请
- 专利标题： Conductor Structural Element and Method for Producing a Conductor Structural Element
- 专利标题（中）： 导体结构元件和生产导体结构元件的方法
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申请号： US13515012申请日： 2010-12-17
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公开(公告)号： US20120320549A1公开(公告)日： 2012-12-20
- 发明人: Thomas Gottwald , Alexander Neumann
- 申请人： Thomas Gottwald , Alexander Neumann
- 申请人地址： DE Schramberg
- 专利权人： Schweizer Electronic AG
- 当前专利权人： Schweizer Electronic AG
- 当前专利权人地址： DE Schramberg
- 优先权： DE102009060480.4 20091218
- 国际申请： PCT/EP2010/007736 WO 20101217
- 主分类号： H05K7/00
- IPC分类号： H05K7/00 ; H05K3/46 ; H01L23/48
摘要：
The present invention relates to a method for producing a conductor structural element, comprising providing a rigid substrate, electrodepositing a copper coating on the rigid substrate, applying a conductor pattern structure to the copper coating, then possibly mounting components, laminating the substrate with at least one electrically insulating layer, detaching the rigid substrate, at least partially removing the remaining copper coating of the rigid substrate in such a way that the conductor pattern structure is exposed.
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