Invention Application
- Patent Title: Easy-to-Lay Floor Board
- Patent Title (中): 易于铺平的地板
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Application No.: US13519063Application Date: 2010-08-27
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Publication No.: US20120324816A1Publication Date: 2012-12-27
- Inventor: Huanwen Huang
- Applicant: Huanwen Huang
- Applicant Address: CN Hong Kong
- Assignee: HONG KONG MEI LI SHENG FLOORING CO., LIMITED
- Current Assignee: HONG KONG MEI LI SHENG FLOORING CO., LIMITED
- Current Assignee Address: CN Hong Kong
- Priority: CN200910215155.6 20091223; CN201010123676.1 20100208; CN201010203493.0 20100609
- International Application: PCT/CN2010/001304 WO 20100827
- Main IPC: E04B5/00
- IPC: E04B5/00 ; E04F13/21

Abstract:
Aspects relate to improved floor boards. Certain embodiments may be laid and fixed without the need for fixing with adhesive or nails. Example floor boards are convenient for use and simple in structure, and after a decorative strip is adopted, it further has the advantage of good decorative effects. In one embodiment, a floor board includes a four-sided surface board connected to a four-sided base board. In one embodiment, positions of board-shaped hooking tongues on two edges of the base board body and positions of board-shaping hooking tongues on two other edges of the base board body are arranged in a staggered manner, and the positions of buckles on two edges of the base board body and the positions of buckles on two other edges of the base board body are arranged in a staggered manner.
Public/Granted literature
- US09499979B2 Interlocking modular floor tile Public/Granted day:2016-11-22
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