发明申请
- 专利标题： METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE
- 专利标题（中）： 组装半导体器件的方法
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申请号： US13489462申请日： 2012-06-06
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公开(公告)号： US20120326288A1公开(公告)日： 2012-12-27
- 发明人: Meiquan Huang , Hejin Liu , Zhijie Wang , Dehong Ye , Hanmin Zhang
- 申请人： Meiquan Huang , Hejin Liu , Zhijie Wang , Dehong Ye , Hanmin Zhang
- 申请人地址： US TX Austin
- 专利权人： FREESCALE SEMICONDUCTOR, INC
- 当前专利权人： FREESCALE SEMICONDUCTOR, INC
- 当前专利权人地址： US TX Austin
- 优先权： CN201110169920.2 20110623
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/495
摘要：
A method of assembling a semiconductor device includes providing a conductive lead frame panel and selectively half-etching a top side of the lead frame panel to provide a pin pads. A flip chip die is attached and electrically connected to the pin pads and then the lead frame panel and die are encapsulated with molding compound. A second selective half etching step is performed on a backside of the lead frame panel to form a plurality of separate input/output pins. The side walls of each input/output pin include arcuate surfaces in cross-section.
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