Invention Application
- Patent Title: METHOD OF ASSEMBLING SEMICONDUCTOR DEVICE
- Patent Title (中): 组装半导体器件的方法
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Application No.: US13489462Application Date: 2012-06-06
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Publication No.: US20120326288A1Publication Date: 2012-12-27
- Inventor: Meiquan Huang , Hejin Liu , Zhijie Wang , Dehong Ye , Hanmin Zhang
- Applicant: Meiquan Huang , Hejin Liu , Zhijie Wang , Dehong Ye , Hanmin Zhang
- Applicant Address: US TX Austin
- Assignee: FREESCALE SEMICONDUCTOR, INC
- Current Assignee: FREESCALE SEMICONDUCTOR, INC
- Current Assignee Address: US TX Austin
- Priority: CN201110169920.2 20110623
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/495
Abstract:
A method of assembling a semiconductor device includes providing a conductive lead frame panel and selectively half-etching a top side of the lead frame panel to provide a pin pads. A flip chip die is attached and electrically connected to the pin pads and then the lead frame panel and die are encapsulated with molding compound. A second selective half etching step is performed on a backside of the lead frame panel to form a plurality of separate input/output pins. The side walls of each input/output pin include arcuate surfaces in cross-section.
Information query
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