Invention Application
- Patent Title: NANOSCALE INTERCONNECTS FABRICATED BY ELECTRICAL FIELD DIRECTED ASSEMBLY OF NANOELEMENTS
- Patent Title (中): 由电场指导的纳米组件制成的纳米互连
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Application No.: US13499809Application Date: 2010-10-01
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Publication No.: US20120326310A1Publication Date: 2012-12-27
- Inventor: Ahmed Busnaina , Cihan Yilmaz , TaeHoon Kim , Sivasubramanian Somu
- Applicant: Ahmed Busnaina , Cihan Yilmaz , TaeHoon Kim , Sivasubramanian Somu
- International Application: PCT/US10/51129 WO 20101001
- Main IPC: C25B15/00
- IPC: C25B15/00 ; C25B11/02 ; H01L23/482 ; B82Y40/00 ; B82Y99/00

Abstract:
The invention provides a fast, scalable, room temperature process for fabricating metallic nanorods from nanoparticles or fabricating metallic or semiconducting nanorods from carbon nanotubes suspended in an aqueous solution. The assembled nanorods are suitable for use as nanoscale interconnects in CMOS-based devices and sensors. Metallic nanoparticles or carbon nanotubes are assembled into lithographically patterned vias by applying an external electric field. Since the dimensions of nanorods are controlled by the dimensions of vias, the nanorod dimensions can be scaled down to the low nanometer range. The aqueous assembly process is environmentally friendly and can be used to make nanorods using different types of metallic particles as well as semiconducting and metallic nanaotubes.
Public/Granted literature
- US08937293B2 Nanoscale interconnects fabricated by electrical field directed assembly of nanoelements Public/Granted day:2015-01-20
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