Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13529564Application Date: 2012-06-21
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Publication No.: US20120329252A1Publication Date: 2012-12-27
- Inventor: WonSeok Yoo , Nam-Kyu Kim , Bonghyun Kim , Seung Hun Lee , Heedon Hwang
- Applicant: WonSeok Yoo , Nam-Kyu Kim , Bonghyun Kim , Seung Hun Lee , Heedon Hwang
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2011-0060783 20110622
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
A semiconductor device may include a semiconductor substrate with an active region, a gate line disposed on the active region, an epitaxial pattern disposed on the semiconductor substrate beside the gate line, the epitaxial pattern including a semiconductor material different from the semiconductor substrate, and a capping pattern disposed on the epitaxial pattern. The capping pattern may improve contact with contact plug and may reduce variation in mean ion depths of an associated field effect transistor.
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