Embodiments described herein provide a method of manufacturing integrated circuit (IC) devices. The method includes coupling a first surface of a first intermediate substrate to a first surface of a second intermediate substrate, forming a first plurality of patterned metal layers on a second surface of the first intermediate substrate to form a first substrate and a second plurality of patterned metal layers on a second surface of the second intermediate substrate to form a second substrate, and separating the first and second substrates. Each of the first substrate and the second substrate is configured to facilitate electrical interconnection between a respective IC die and a respective printed circuit board (PCB).