发明申请
- 专利标题： SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- 专利标题（中）： 半导体器件及其制造方法
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申请号： US13534078申请日： 2012-06-27
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公开(公告)号： US20130001804A1公开(公告)日： 2013-01-03
- 发明人: YOSHIHIKO SHIMANUKI , Yoshihiro Suzuki , Koji Tsuchiya
- 申请人： YOSHIHIKO SHIMANUKI , Yoshihiro Suzuki , Koji Tsuchiya
- 专利权人： RENESAS ELECTRONICS CORPORATION
- 当前专利权人： RENESAS ELECTRONICS CORPORATION
- 优先权： JP2002-191666 20020701
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
There are constituted by a tab on which a semiconductor chip is mounted, a sealing portion formed by resin-sealing the semiconductor chip, a plurality of leads each having a mounted surface exposed to a peripheral portion of a rear surface of the sealing portion and a sealing-portion forming surface disposed on an opposite side thereto, and a wire for connecting a pad of the semiconductor chip and a lead, wherein the length between inner ends of the sealing-portion forming surfaces of the leads disposed so as to oppose to each other is formed to be larger than the length between inner ends of the mounted surfaces. Thereby, a chip mounting region surrounded by the inner end of the sealing-portion forming surface of each lead can be expanded and the size of the mountable chip is increased.
公开/授权文献
- US08390133B2 Semiconductor device and manufacturing method thereof 公开/授权日：2013-03-05
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