发明申请
- 专利标题: MISALIGNMENT TOLERANT CONTACTLESS RF COUPLING DEVICE
- 专利标题(中): MISALIGNMENT耐用无连接射频耦合器件
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申请号: US13174178申请日: 2011-06-30
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公开(公告)号: US20130002376A1公开(公告)日: 2013-01-03
- 发明人: Conrad Ihla , Robert Charles Becker , Glen Backes , Alan Cornett , Matthew S. Marcus
- 申请人: Conrad Ihla , Robert Charles Becker , Glen Backes , Alan Cornett , Matthew S. Marcus
- 申请人地址: US NJ Morristown
- 专利权人: Honeywell International Inc.
- 当前专利权人: Honeywell International Inc.
- 当前专利权人地址: US NJ Morristown
- 主分类号: H01P5/00
- IPC分类号: H01P5/00
摘要:
Some embodiments relate to a contactless RF coupling device that includes a first substrate and a second substrate. The RF coupling device may provide a broadband, low loss electrical connection without mechanical contact as would a conventional mechanical connector. The first substrate includes a first ground plane on one side and a first transmission line on an opposing side. The first transmission line includes an enlarged first coupling member at an end of the first transmission line. The second substrate includes a second ground plane on one side and a second transmission line on an opposing side. The second transmission line includes an enlarged second coupling member at an end of the second transmission line. The first ground plane may not extend under the first coupling member and the second ground plane may include an opening that is aligned with the second coupling member.
公开/授权文献
- US08633784B2 Misalignment tolerant contactless RF coupling device 公开/授权日:2014-01-21