Thermally conductive thermoplastic resin compositions are provided containing thermoplastic resin and thermally conductive filler and fibrous filler, along with articles made therefrom. In certain instances when the thermally conductive filler and fibrous filer are more restricted, and other ingredients are present, the thermally conductive composition exhibits an improved volume resistibility and is suitable for fabricating a chassis for LCD display. Also described are the thermally conductive resin compositions, especially when the polymer is LCP. Such compositions are useful for items such as electrical and electronic housings requiring highly thermally conduciveness.