Invention Application
- Patent Title: MOUNTING APPARATUS FOR MOTHERBORAD
- Patent Title (中): MOTHERBORAD安装设备
-
Application No.: US13237950Application Date: 2011-09-21
-
Publication No.: US20130009026A1Publication Date: 2013-01-10
- Inventor: HUNG-CHUN LU
- Applicant: HUNG-CHUN LU
- Applicant Address: TW Tu-Cheng
- Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: TW Tu-Cheng
- Priority: TW100124356 20110708
- Main IPC: H05K7/14
- IPC: H05K7/14

Abstract:
A mounting apparatus for a motherboard includes a chassis, a bracket, a resilient plate, and a handle. The chassis includes a sidewall, and a fastener formed on an inner surface of the sidewall. The bracket is fixed to a side of the motherboard. The resilient plate includes a fixing portion fixed to a side of the bracket facing the sidewall, a connecting portion slantingly extending toward the sidewall from the fixing portion, and a resilient arm extending from the connecting portion away from the fixing portion and defining a latching hole. The handle is pivotably connected to the bracket and includes a first plate. When the handle is rotated towards the bracket, the first plate is inserted into a space between the resilient arm and the bracket, and deforms the resilient arm towards the sidewall. The fastener engages in the latching hole of the resilient arm.
Public/Granted literature
- US08534628B2 Mounting apparatus for motherboard Public/Granted day:2013-09-17
Information query