发明申请
- 专利标题: Method for Manufacturing Semiconductor Device
- 专利标题(中): 半导体器件制造方法
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申请号: US13547393申请日: 2012-07-12
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公开(公告)号: US20130009247A1公开(公告)日: 2013-01-10
- 发明人: Kazuya Hanaoka , Miki Suzuki
- 申请人: Kazuya Hanaoka , Miki Suzuki
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 优先权: JP2008-217613 20080827
- 主分类号: H01L27/12
- IPC分类号: H01L27/12
摘要:
It is an object to form a conductive region in an insulating film without forming contact holes in the insulating film. A method is provided, in which an insulating film is formed over a first electrode over a substrate, a first region having many defects is formed at a first depth in the insulating film by adding first ions into the insulating film at a first accelerating voltage; a second region having many defects is formed at a second depth which is different from the first depth in the insulating film by adding second ions into the insulating film at a second accelerating voltage, a conductive material containing a metal element is formed over the first and second regions; and a conductive region which electrically connects the first electrode and the conductive material is formed in the insulating film by diffusing the metal element into the first and second regions.
公开/授权文献
- US08530973B2 Method for manufacturing semiconductor device 公开/授权日:2013-09-10
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