Invention Application
- Patent Title: SIPE GEOMETRY FOR IMPROVED BUFFING OF TREAD BAND
- Patent Title (中): SIPE几何改进条带的缓冲
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Application No.: US13618533Application Date: 2012-09-14
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Publication No.: US20130020003A1Publication Date: 2013-01-24
- Inventor: Juan-Pablo Gallego , Nathan J. Panning
- Applicant: Juan-Pablo Gallego , Nathan J. Panning
- Applicant Address: CH GRANGES-PACCOT
- Assignee: MICHELIN RECHERCHE ET TECHNIQUE S.A.
- Current Assignee: MICHELIN RECHERCHE ET TECHNIQUE S.A.
- Current Assignee Address: CH GRANGES-PACCOT
- Main IPC: B60C11/11
- IPC: B60C11/11 ; B29D30/06 ; B60C11/12

Abstract:
A mold for a tread layer having tread-forming side and sole-forming side, the sole-forming side having a plurality of mold elements extending there from toward the tread-forming side. Either the mold elements or the sole-forming side of the mold is configured to create a tread layer having a recessed tread element such as an incision, lateral groove, longitudinal groove or other void on the sole side of the tread layer that enables the edges of the recessed tread element to obtain full coverage when subjected to an abrasion process.
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